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2019 OCP Global Summit
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EW: Advanced Cooling
EW: Data Center Facility
EW: HPC & GPU/FPGA Technology
EW: HW Management
EW: Networking: Hardware
EW: Networking: Software
EW: NIC 3.0 Development
EW: OSF/Security
EW: Rack & Power
EW: Server
EW: SONiC
EW: Storage
EW: Telco & openEDGE
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Damien Chong
Facebook
Hardware Engineer
My Speakers Sessions
Friday
, March 15
8:30am PDT
The Journey of OCP NIC3.0 Solution Integration and Demo
210 A
Damien Chong • Ben Wei
Timezone
2019 OCP Global Summit
America/Los Angeles
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2019 OCP Global Summit
Mar 12
-
15, 2019
Tuesday
, March 12
Wednesday
, March 13
Thursday
, March 14
Friday
, March 15
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San Jose McEnery Convention Center
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210 A
210 BF
210 CG
210 DH
210 E
211 AB
211 CD
212 AB
212 CD
Expo Hall 1
Grand Ballroom
LinkedIn Building R
Lobby
Lower Level - Tables in Open Area - See Map
Marriott Salon I&II
Marriott Salon III
Marriott Salon IV
Marriott Salon V&VI
Rittal
The Hub
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EW: Advanced Cooling
EW: Data Center Facility
EW: HPC & GPU/FPGA Technology
EW: HW Management
EW: Networking: Hardware
EW: Networking: Software
EW: NIC 3.0 Development
EW: OSF/Security
EW: Rack & Power
EW: Server
EW: SONiC
EW: Storage
EW: Telco & openEDGE
Executive Track
Expo Hall
Expo Hall Talk
Keynote
Meals
Registration
Symposium
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