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Thursday, March 14 • 1:00pm - 1:25pm
OCP NIC 3.0: A Collaborative Industry Effort to Create a New Server Connectivity Standard - presented by Intel

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In creating the original OCP mezzanine specification in 2012, Facebook sought to define a standard for cost-effective, high-density server connectivity within the OCP framework. In the years since that introduction, the OCP NIC project has gained momentum, with broad industry participation and OCP-NIC-based cards available from most server and Ethernet vendors. While server OEMs continue to support custom cards to enable specific features, recent advancements within the OCP NIC project provide the industry with an opportunity to standardize on a common form factor.

The OCP NIC 3.0 specification, written and in the process of being ratified by the OCP committee members, includes support for advanced network controller features, including additional power, PCIe Bifurcation, and enhanced manageability and generally incorporates key leanings from earlier versions of the specification. With contributions from industry leaders including Facebook, Intel, server OEMs, and Ethernet vendors, OCP NIC 3.0 will simplify adoption of a common mezzanine form factor in server solutions including Cloud, Enterprise, Comms, and others.


Brad Burres

Senior Principal Engineer, Chief SmartNIC Architect, DCG Architecture, Intel

Thursday March 14, 2019 1:00pm - 1:25pm PDT
210 DH