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Friday, March 15 • 1:30pm - 1:55pm
OCP NIC Thermal Test Fixture Standardization and Demo (Server WG)

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As OCP NIC form factor evolving into 3.0 version, there are rising needs to standardize thermal characteristic testing methodology among NIC suppliers, system suppliers and hyper-scale users. This session will be a joint session between Dell EMC and FB to talk about the design of the thermal test fixture and how to leverage it for further development of NIC 3.0 spec with a live Demo.

Speakers
avatar for Yueming Li

Yueming Li

Thermal Engineer, Facebook
avatar for Hemal Shah

Hemal Shah

Distinguished Engineer, Broadcom
Hemal Shah is a Distinguished Engineer and Systems/Software/Standards architect in the Compute and Connectivity (CCX) division at Broadcom Inc. He leads a team of architects. In his role, he is responsible for the product architecture definition of Ethernet NIC products, NIC integration... Read More →
avatar for Jon Lewis

Jon Lewis

Distinguished Engineer, Dell EMC


Friday March 15, 2019 1:30pm - 1:55pm PDT
210 A