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Friday, March 15 • 9:00am - 9:12am
OCP NIC 3.0 Design and Implementation Experiences

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OCP NIC 3.0 specification as a follow-on to OCP Mezz 2.0 specification has enabled a wider spectrum of next generation NIC board designs. As a leading provider of NICs and Smart NICs, Broadcom has been at the forefront of OCP NIC 3.0 specification and designs. In this talk, we will share Broadcom’s implementation experiences with OCP NIC 3.0 designs. We will cover mechanical, electrical, thermal, host interface, manageability, and firmware security aspects of OCP NIC 3.0 designs.


Long Nguyen

Master Hardware Engineer, Broadcom Inc.
avatar for Hemal Shah

Hemal Shah

Distinguished Engineer, Broadcom
Hemal Shah is a Distinguished Engineer and Systems/Software/Standards architect in the Compute and Connectivity (CCX) division at Broadcom Inc. He leads a team of architects. In his role, he is responsible for the product architecture definition of Ethernet NIC products, NIC integration... Read More →

Friday March 15, 2019 9:00am - 9:12am PDT
210 A