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Friday, March 15 • 3:00pm - 3:25pm
Eco-system Enabling of Liquid Cooling Ingredients

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The continued demand for increased compute performance comes with an increase in server power and power density. The increased server power requires more efficient cooling capabilities compared to traditionally used air cooling. Direct liquid cooling using cold plates can provide the needed cooling capability, as well as fit within a small volume to allow for greater server and compute density in the rack. Even though liquid cooling is not a new cooling strategy for servers, the industry is not ready to efficiently deploy liquid cooling solutions in mass. Therefore, Intel is working to enable liquid cooling ingredients with industry partners. The intent is to create more available, lower risk, and faster time to market opportunity for OEMs to deploy liquid cooling solutions. Intel’s efforts are specifically focused on manifold distributed liquid cooling at the server rack level (i.e. the secondary cooling loop). The secondary loop is the fluid loop providing the cooling liquid from the Cooling Distribution Unit (CDU) through the rack manifold to the server cold plates, and then back again to the CDU through the rack manifold. The liquid cooling ingredients in the secondary loop included in Intel’s enabling efforts are: cooling liquid, CDU, interchangeable Universal Quick Disconnects (UQD), cold plates, and design considerations for the secondary loop including the in-rack manifold. Intel’s enabling efforts, together with Intel’s strategy to enable these ingredients will be discussed in the presentation at the OCP summit. This presentation will not discuss specific internal chassis fluid loops, or cold plate designs, except for the CPU cold plate.

avatar for Mark Sprenger

Mark Sprenger

Tech Lead Engineer, Intel
Mark Sprenger is Senior Mechanical Engineer and Technical Lead in Data Platform Group responsible for external development of cooling solutions for commercial datacenter products. Mark has over 25 years of industry experience in advanced development covering a wide variety of technologies... Read More →
avatar for Jessica Gullbrand

Jessica Gullbrand

Tech Lead Thermal Engineer, Intel
Jessica is a Thermal Tech Lead Engineer at Intel in the Data Platform Group (DPG). She is currently working on energy efficiency, immersion, and liquid cooling cold plate technologies. Jessica has worked on new and innovative technology solutions in fluids, acoustics, and thermals... Read More →

Friday March 15, 2019 3:00pm - 3:25pm PDT
210 E